solder joint
英 [ˈsəʊldə(r) dʒɔɪnt]
美 [ˈsɑːdər dʒɔɪnt]
网络 焊点; 焊接; 焊接接头; 焊接缝; 焊接连接
双语例句
- Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对形成的混合焊点进行可靠性分析。 - Effect of Thermomechanical Fatigue on Properties of Lead-Free Solder Joint with Nano-Structured Reinforcements
热疲劳对纳米结构强化的无铅焊点性能的影响 - Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响 - Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution;
热疲劳；随机变量；概率分析；焊点；对数正态分布； - Thermal reliability optimization study on PBGA lead-free solder joint
PBGA无铅焊点热可靠性优化研究 - BGA Solder Joint Defects Image Processing Method Based on 2D Imaging by Radiographic Real Time Testing
基于2D投影的BGA焊点X射线检测缺陷图像处理方法 - The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.
该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。 - Impacts of Void Defects on Thermal Fatigue Life in Coaxial-cable Solder Joint
气孔缺陷对同轴电缆焊点热疲劳寿命影响 - The prediction of fatigue life, especially high-cycling fatigue life, of a solder joint is one of the most difficult problems in electronic industry.
最后，提出了简便预测这类结构的高周疲劳寿命方法，且预测结果与试验结果吻合较好。 - Thermal Fatigue Reliability Analysis of High Speed Backplane Solder Joint Based on Orthogonal Experiment
基于正交试验法的高速背板焊点热疲劳可靠性分析 - Effect of BGA Solder Joint Void on Signal Transmission Performance
BGA焊点空洞对信号传输性能的影响 - Are AOI/ AXI complementary methods, which include solder joint inspection, used for all reflowed parts?
AOI/AXI的检验方法包括焊接点的检验，是否用于回流焊元件检测？ - Resistance strain and temperature hysteresis loops properties of lead free solder joint
无铅焊点的电阻应变温度迟滞回线特性 - In the modern automotive industry, extensive use of spot-welding in the body, the solder joint failure is the main reason leading to vehicle failure.
在现代汽车工业中，点焊广泛运用在车身中，焊点失效是导致车身失效的主要原因。 - And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。 - Size effect of mechanical behavior of miniature solder joint interconnections in electronic packaging
电子封装微互连焊点力学行为的尺寸效应 - Secondly, the radiance model of the illuminator and the irradiance model of the solder joint are developed.
然后，建立了光源的照度模型以及焊点的反射模型。 - The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。 - Reliability Research on Solder Joint of Plastic Ball Grid Array Component
PBGA器件焊点的可靠性分析研究 - Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
利用ANSYS工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。 - The solder joint shape of MCM bonded with flip chip is studied and its design principle and method based on stress analysis is presented. Its model establishment of thermal deformation is also discussed in this paper.
通过对以FC技术形成的MCM焊点接合部形态问题进行研究，提出了基于应力解析的MCM焊点形态设计原理和方法，并对MCM焊点热变形模型的建立等问题进行了探讨。 - Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。 - Defect Analysis and Process Improvement of BGA Solder Joint
BGA焊点的缺陷分析与工艺改进 - Solder joint inspection becomes a important and difficult.
焊点检测成为检测的重点和难点。 - Classify the defect according to the type of BGA Solder Joint defects.
根据BGA器件焊点缺陷类型对缺陷分类。 - The influence of atmosphere on the solder joint of different solder alloys and different solder pad systems was different.
回流气氛对不同焊料合金在不同焊盘上回流得到的焊点的影响是不同的。 - The results have an important guiding significance on solder joint failure analysis.
论文的研究结果对焊点失效分析工作具有重要的指导意义。 - Furthermore, reflow temperature and reflow cycles are another two factors affecting solder joint property.
回流温度和回流次数也是影响焊点质量的两个重要因素。 - Electromigration of solder joint is becoming one of the key factors of the reliability of electronic packaging.
焊点中的电迁移是影响电子封装可靠性的关键因素之一。 - Analysis of solder joint position, check multilayer welding.
分析焊点位置，检查多层板焊接。